Electronic product hardware solutions

As electronic products develop towards lighter weight, higher integration, and better heat dissipation, die-casting technology (especially aluminum alloy and magnesium alloy die-casting) is increasingly used in structural parts, heat dissipation components, and electromagnetic shielding parts of electronic products. The following are key applications and solutions of die-casting in electronic products.

1. Core Application Areas

(1) Consumer Electronics (Mobile Phones, Tablets, Laptops)

Mid-frame/Housing: Magnesium alloy or aluminum alloy die-casting, balancing lightweight and strength (e.g., MacBook body).

Heat Dissipation Module: High thermal conductivity aluminum alloy die-cast heat sinks, heat spreader housings.

Internal Brackets: Camera brackets, SIM card trays (high-precision zinc alloy die-casting).

(2) Communication Equipment (5G Base Stations, Routers)

Antenna Housings: Aluminum alloy die-casting (electromagnetic shielding + lightweight).

Filter Cavities: High-precision die-casting, reducing signal interference.

Heatsinks/Housings: Optimized airflow design, improving heat dissipation efficiency.

(3) Smart Wearables (TWS Earbuds, Smartwatches)

Earbud Charging Case: Magnesium alloy die-casting (weight reduction + wear resistance).

Watch Housing/Mid-frame: High-gloss aluminum alloy die-casting + CNC machining.

(4) Electronic Cooling Systems

CPU/GPU Cooling Modules: Die-cast aluminum fins + heat pipe inserts.

LED Lamp Housings: High thermal conductivity aluminum alloy, improving heat dissipation performance.

2. Material Selection

3. Key Process Optimization

(1) High-precision die-casting (±0.05mm tolerance)

Suitable for miniature connectors, camera brackets, and other precision parts.

Using In-mold trimming technology to reduce post-processing.

(2) Ultra-thin wall die-casting (0.5-1.0mm)

Used for smartwatch housings, earphone charging cases, reducing weight.

Optimize mold flow channel design to avoid insufficient filling.

(3) Insert Molding

Metal + plastic combination (e.g., plastic insulation layer embedded in antenna housing).

Metal + heat pipe combination (integrated molding of heat dissipation module).

(4) Semi-solid die casting (SSM)

Reduce porosity, improve density (suitable for high thermal conductivity parts).

Used for 5G base station heat dissipation housings, high-end electronic housings.

4. Surface Treatment Technology

Anodizing (Aluminum Alloy): Improves wear resistance (e.g., MacBook housing).

Micro-arc oxidation (Magnesium Alloy): Enhances corrosion resistance (e.g., smartwatches).

PVD coating (Zinc Alloy): Improves appearance and texture (e.g., high-end earphone housings).

Conductive Coating: Used for electromagnetic shielding (e.g., 5G antenna housings).

5. Industry Challenges and Solutions

6. Innovative Application Cases

✅ Apple MacBook: Uses magnesium alloy die-cast frame, reducing weight by 20%.

✅ Huawei 5G Base Station: High thermal conductivity aluminum alloy die-cast heat sink, improves heat dissipation efficiency by 30%.

✅ AirPods Charging Case: Ultra-thin magnesium alloy die casting, weighing only 10g.

✅ Gaming Laptop Cooling Module: Embedded heat pipe, reduces CPU temperature by 15°C.

7. Future Trends

🔹 Lighter and Thinner: 0.3mm ultra-thin wall die-casting technology (for foldable devices).

🔹 Higher Integration: Die casting + CNC + laser welding integrated manufacturing.

🔹 Intelligent Die Casting: AI real-time control of injection parameters to improve yield.

🔹 Green Manufacturing: Promote the use of recycled aluminum/magnesium alloys to reduce carbon footprint.

Summary

The application of die casting in electronic products is evolving from traditional structural components to high thermal conductivity, ultra-precision, multi-functional integration oriented development.

Low-cost solution: Aluminum alloy die casting + sandblasting (router housing).

High-end solution: Magnesium alloy semi-solid die casting + micro-arc oxidation (smart watch).

Heat dissipation optimization: High thermal conductivity aluminum + embedded heat pipe (5G base station heat sink).

Companies can choose the appropriate material and process combination according to product needs to enhance competitiveness.